Nɔrɔnan min be yɛlɛma ka gwɛ kuranfɛnw kama

Hot Melt Adhesive for Electronics labɛnna kɛrɛnkɛrɛnnin na ka ɲɛsin -minɛn gwɛmanw, fanga-minɛnw, LED-bolilafɛnw ani minan fitininw dilanbagaw ma minw mako be lajɛn telimanw na, minw saniyanin lo ani u be lamini latanga wagatijan kɔnɔ. O nɔrɔnan be bɔ ka ɲɛ degere 150-170 la ka tɛmɛ 11 mm nɔrɔnan marifaw fɛ wala mikro-dilanyɔrɔw fɛ, ka ABS, PC, PP, aliminiyɔmu ani zira jigi k’a sɔrɔ a ma nɔgɔ wala a ma filɛri kɛ. Sekɔndi 3-6 kɔnɔ, nɔrɔnan be nɛnɛ ka kɛ thermoplastique gɛlɛn ye, gwɛman, min tɛ nɛrɛmuguman ye min be 3,5 MPa fanga di ABS/ABS nɔrɔyɔrɔw kan ani a be tɛmɛ lɛrɛ 1000 kɔnɔ degere 70 /85 % RH la k’a sɔrɔ a ma girinya wala a ma pɛrɛn.

110 degere Ring-&-Ball softening point min labɛnnin lo ka ɲɛ, o be polimɛri mara a ka fanga la minɛnw ka yɛrɛ-{3}}kalaya wagati la, nka a be se ka baara kɛ ni funteni dɔgɔman ye min be fɛnw latanga minw be funteni minɛ i n’a fɔ SMD ka kondansɛriw ani thi}n6. Ni a siginin lo, nɔrɔnan be jii -bali filimu dɔ dilan min be to ka buguri-tugu yɔrɔ datuguyɔrɔw la, juru donyɔrɔw la ani PCB gɛrɛfɛ minw tɛ nɛgɛdaga ye, o min b’a to silikɔni nɛgɛw wala epokisi fila -yɔrɔ mako be tigɛ. O la, a be se ka kɛ ko 50 μg g−1 (EU ISO 16000-6) ka dɔgɔ ni 50 μg g−1 (EU ISO 16000-6) ye ani kasa hakɛ min tɛ se ka ye milimɛtiri 50 yɔrɔ la, o be dɛmɛ don ka baarakɛyɔrɔw ka sariyaw labato.

100 % tɛ ni halozɛni, antimoni, nɛgɛ girinmanw, ftalatiw ani fɔrmaldiyidi ye, a be bɛn ni RoHS 2.0, REACH SVHC 240 ye. 230 V sɛrɛkiliw ani LED yɔrɔw. O lɔgɔ min be yɛlɛma yɛlɛma, o be yɔrɔw nɔrɔ joona, a be jii n’a buguri bali, a be se ka kisi minanw ka baarakɛminanw ka funteni ma ani a be baarakɛyɔrɔ mara binkɛnɛman ye, Hot Melt Adhesive for Electronics be fura dɔ di min labɛnnin lo ka baara kɛ n’a ye, min tɛ wari bɔ ani min be tɛmɛ sariyaw bɛɛ kan.

Tagasogow: nɔrɔnan min be yɛlɛma ka gwɛ kuranfɛnw kama, Sinuwaw ka nɔrɔnan min be yɛlɛma ka gwɛ kuranfɛnw dilanbagaw, feerekɛlaw, izini